It has chemical formula c 8 h 8 bcb is frequently used to create photosensitive polymers. Application benzocyclobutene was used as the adhesive bonding material in adhesive waferlevel bonding technique. This technology allows to fabricate a variety of reliable waferbonded components in a fairly simple. Gutmann1,3 1 department of electrical, computer, and systems. Presented is a novel process of benzocyclobutene bcb bonding for a wafer level package with stamp printing, in which the bcb structure is transferred and patterned by pressing the cap wafer towards. Bcb wafer bonding compatible with bulk micro machining. For convenience, a silicon wafer 100 is used as the substrate. A report is presented on the optical propagation loss of waveguides based on inp nanowires embedded in a benzocyclobutene matrix and fabricated through a wafer bonding process.
Read selective waferlevel adhesive bonding with benzocyclobutene for fabrication of cavities, sensors and actuators a. Osa thinfilm devices fabricated with benzocyclobutene. Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer level integration of mems and lsi m makihata1, s tanaka1, m muroyama1, s matsuzaki1, h yamada2, t nakayama2, u yamaguchi2,kmima2, y nonomura3, m fujiyoshi3 and m esashi1 1 tohoku university, japan 2 toyota motor corp. Silicon wafer to be coated with benzocyclobutene bcb 402235 resin should. Besides acting as construction module, bcb and su8 have also been used to join two or more wafers 45. Structure release and chip separation are realized by throughwafer. Adhesive wafer bonding using a molded thick benzocyclobutene layer for waferlevel integration of mems and lsi m makihata1, s tanaka1, m muroyama1, s matsuzaki1, h yamada2, t nakayama2, u. This study investigated the process conditions during bonding and waveguide fabrication with a view to reducing the propagation loss. Applications include wafer bonding, optical interconnects, low. Ultra i310 as the intermediate bonding material is described. Wafer bonding at the end of the wafer processing is a common method in mems fabrication, where a kind of wafer level assembly is performed by mounting protective caps over the mechanically sensitive mems structures. The introduction of bcb benzocyclobutene, dryetchable polymers, makes it possible to pattern the adhesive layer in a similar fashion with the rest of the bulk material.
Due to the flowability of benzocyclobutene bcb and the unavoidable shear components of the bonding force applied by bonding facilities, it is quite challenging to achieve voidfree bcb. Monolithic integrated circuits, threedimensional integrated circuits, wafer bonding, wafer scale integration. However, the conditions of the bonding and fabrication process strongly affect the propagation loss of waveguides. Bcbbased polymer dielectrics may be spun on or applied to a variety of. Selective wafer level adhesive bonding with benzocyclobutene. Low temperature wafer bonding is a powerful technique for memsmoems devices fabrication and packaging. Specifically adhesive wafer bonding with benzocyclobutene bcb and the negative photoresist. Adhesive wafer bonding for waferlevel fabrication of.
Laser direct patterning of dry etch bcb adhesive layers. This seals the functional cavities, to stabilize chips or to apply other functional elements such as optical windows figure 33. Bcb is emerging as an attractive bonding adhesive for wafer bonding in 3d integration. This technology allows to fabricate a variety of reliable waferbonded. In this paper, we propose an extremely simple, robust, and costeffective fabrication process for wafer level capping of mems devices and imaging sensors by adhesive wafer bonding. Benzocyclobutene bcb was used as a bonding agent to bond gasb and epitaxial. Costefficient waferlevel capping for mems and imaging. Photosensitive benzocyclobutene has been widely used as dielectric material in. Wafer bonding with bcb and su8 for mems packaging ieee xplore. Thinfilm devices fabricated with benzocyclobutene adhesive wafer bonding. To microelectronic engineers, bcb stands for benzocyclobutene, a polymeric material that combines bonding capability with appropriate electronic properties for chip manufacturing. In this paper, we propose an extremely simple, robust, and costeffective fabrication.
Threedimensional inpdhbt on sigebicmos integration by means of benzocyclobutene based wafer bonding for mmwave circuits. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding for mems applications request pdf. Indirect wafer bonding and epitaxial transfer of gasb. The emergence of benzocyclobutene in bonding electronics. However, due to the decreased flow capability of that material after exposure, high bond forces and extended bonding times during wafer bonding as well as nearly flat surfaces with low topography are. In this paper we present a new adhesive wafer bonding process that involves partially curing crosslinking of the benzocyclobutene bcb coatings prior to. A conceptual schematic of the viafirst approach is illustrated in figure 1. Although the bonding strength of bcb is satisfactory with the assist of adhesion promoter, it is found that bcb.
Michael gallagher, jonguk kim, eric huenger, kai zoschke, christina lopper, and michael toepper 2012 low temperature wafer level bonding using benzocyclobutene adhesive. Due to the flowability of benzocyclobutene bcb and the unavoidable shear components of the bonding force applied by bonding facilities, it is quite challenging to achieve voidfree bcb adhesive bonding. Based on the aforementioned w2w bonding method, we propose an alternative proprietary highthroughput multiple d2w bonding method. The patterning of this material was done either by dry etching of the bcb or by using a photosensitive. Pdf voidfree bcb adhesive wafer bonding with high alignment.
Benzocyclobutene bcb is used to create photosensitive polymers, which require fewer processing steps than dry etch materials. Niklaus f, stemme g, lu jq, gutmann rj 2006a adhesive wafer bonding. The 3d structure is produced by lowtemperature bonding of two preprocessed silicon wafers using the benzocyclobutene bcb polymer. Wafer bonding at the end of the wafer processing is a common method in mems fabrication, where a kind of wafer level assembly is performed by mounting protective caps over the mechanically sensitive. Integration of benzocyclobutene polymers and silicon. Rfmems packaging technique using benzocyclobutene bcb seonho seok, romain crunelle, michel fryziel, nathalie rolland, paulalain rolland. Two bonding technologies are used to realize the iii. Highthroughput multiple diestowafer bonding technology. Benzocyclobutene bcb 402235 polymer thin films by spin.
Osa ultrathin dvsbcb adhesive bonding of iiiv wafers. Adhesive bonding also referred to as gluing or glue bonding describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Bcb adhesive bonding has been identified as the preferred wafer. Delamination of bonding interface between benzocyclobutene. Pdf thinfilm devices fabricated with benzocyclobutene. Rfmems packaging technique using benzocyclobutene bcb. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding e. Benzocyclobutene bcb is a benzene ring fused to a cyclobutane ring. Benzocyclobutene wafer bonding for iiiv nanophotonic guiding structures. Threedimensional inpdhbt on sigebicmos integration by.
Wafer bonding with adhesive glue is a process based. Voidfree bcb adhesive wafer bonding with high alignment. Reliability study of wafer bonding for microelectro. Aligned wafertowafer bonding with dielectric polymer layers e. Niklaus f, kumar rj, mcmahon jj, yu j, lu jq, cale. Pdf due to the flowability of benzocyclobutene bcb and the unavoidable shear components of the bonding force applied by bonding facilities, it is. A variety of polymers have been explored as thinfilm adhesives for wafer bonding. Benzocyclobutene is a strained system which, upon heating to approximately 180. Specific details of a hybrid metalpolymer wafer bonding. Physical on deepdyve, the largest online rental service for scholarly.